Transfer Melamine mold Cleaner
SKU:
Melamine Mold-Cleaner, a thermosetting resin consisting of melamine resin, organic and inorganic fillers,
is designed to clean mold stains which deposited. During molding process for encapsulation of
semiconductors, such as integrated circuits, transistors and Diode, etc.
Cleaning can be accomplished by transfer molding MC-701S or MC-201T (Compression type) at the same condition of epoxy molding compound.
Advantages:
1. Cost Reduction and High Saving in term of cleaning cost
2. Various Manufacturing Method
3. Compound Manufacture Possibility with Special Properties
4. Excellent Cleaning Performance
5. Superiority of Workability Performance
Melamine Mold-Cleaner, a thermosetting resin consisting of melamine resin, organic and inorganic fillers,
is designed to clean mold stains which deposited. During molding process for encapsulation of
semiconductors, such as integrated circuits, transistors and Diode, etc.
Cleaning can be accomplished by transfer molding MC-701S or MC-201T (Compression type) at the same condition of epoxy molding compound.
Advantages:
1. Cost Reduction and High Saving in term of cleaning cost
2. Various Manufacturing Method
3. Compound Manufacture Possibility with Special Properties
4. Excellent Cleaning Performance
5. Superiority of Workability Performance
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