UV Wafer dicing tapes
SKU:
Along with technological advance, wafer sizes are getting bigger and chip sizes are getting smaller, which result longer dicing time, consequently cause several problems;
- silicone dust adhere to wafer surface
- corrosion on Al/Cu bonding pad
LAVACRO is mixed with DI water in dispensing equipment and fed into sawing machine through existing DI water line. Lavacro substantially reduces surface tension of the water, wetting well over wafer surface so that sawing dust hardly stick to the wafer surface.
Hydrophobic functional groups of Lavacro surrounds the dust particles, and the contact angle between dust particles and the wafer surface increases that dust particles being separated from wafer surface and swept away with DI water.
Features:
- Low surface tension to provide a stable film on the wafer surface
- Remove silicon chips and dust
- Clean the silicon wafer surface
- Anti-corrosion property to prevent the galvanic corrosion on Al/Cu bonding pads
- Environmental-friendly solutions, bio-degradable
Along with technological advance, wafer sizes are getting bigger and chip sizes are getting smaller, which result longer dicing time, consequently cause several problems;
- silicone dust adhere to wafer surface
- corrosion on Al/Cu bonding pad
- Low surface tension to provide a stable film on the wafer surface
- Remove silicon chips and dust
- Clean the silicon wafer surface
- Anti-corrosion property to prevent the galvanic corrosion on Al/Cu bonding pads
- Environmental-friendly solutions, bio-degradable
