QFN Backside film
SKU:
- Temporary fixing manufacturing process of high-temperature and high dimensional stability
- Good suitable Pre-Tape For QFN L/F PKG that is demanding stable Wire-Bond ability
- Prevent resin leakage when molding semiconductor packages and electronic components
- Temporary fixing manufacturing process of high-temperature and high dimensional stability
- Good suitable Pre-Tape For QFN L/F PKG that is demanding stable Wire-Bond ability
- Prevent resin leakage when molding semiconductor packages and electronic components
