Paperframe

• An unique product specially designed to substitute conventional metal lead frames or substrate for cost-reduction in mold cleaning process.
• Intentionally developed for melamine cleaning used in transfer encapsulating of electric and electronics components by means of epoxy molding compounds as well as dummy molding.
• Available in the form of single strip and multiple strips.

Features / Benefits:

• No need to change molding temperature and parameters
• Can be used in both auto and manual mold
• Air-vent cleaning design increase cleaning effectiveness in hard-to-reach area
• Easy removal (time saving) from mold surface particularly the multiple strips type
• Safe to use as it is non-corrosive
• More economical value than metal lead frame
• Material are in compliance with RoHS standard
• Easy for disposal after used.
• COST SAVING compared to copper lead frame.
• Environmental-friendly as paper is bio-degradable