Back Grinding Wheels

SKU:

Features / Benefits:

  • Grind all types of wafers with less sub-surface damage

  • Combine diamond abrasives and bond matrix in meeting requirements

 

Application:

  • Used on back grinding machines for thinning and flattening silicon wafers, glass products, ceramic products.

  • Sizes range from 8” to 14” O.D.

  • Used on machines manufactured by Disco, Okamoto, Strasbaugh, and many others.

 

Specification:

  • Available in large variety of bond such as sintered (metal bond), resin bond, vitrified bond, plated (nickel bond).

  • Specification of diamond back grinding wheel can be optimized to fit your particular application/material.

Features / Benefits:

  • Grind all types of wafers with less sub-surface damage

  • Combine diamond abrasives and bond matrix in meeting requirements

 

Application:

  • Used on back grinding machines for thinning and flattening silicon wafers, glass products, ceramic products.

  • Sizes range from 8” to 14” O.D.

  • Used on machines manufactured by Disco, Okamoto, Strasbaugh, and many others.

 

Specification:

  • Available in large variety of bond such as sintered (metal bond), resin bond, vitrified bond, plated (nickel bond).

  • Specification of diamond back grinding wheel can be optimized to fit your particular application/material.

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